Typical hot bar reflow soldering applications include flex circuits, ribbon cables, wires, flex to PCB, flex to LCD, and thermocompression bonding of gold ribbon as found in the telecommunications, computer, automotive, display industries and more.

Hot bar reflow soldering is achieved when two pre-fluxed, solder or adhesive coated parts are heated, causing the solder to melt, flow, and then solidify, forming a permanent electro-mechanical bond. The power supply used utilizes pulsed heat technology which refers to the rapid update of the energy output to the thermode, based on the temperature feedback loop which allows the thermode to heat and cool quickly.

Pulsed heat power supplies are also ideal for heatstaking.  Heatstaking is a method of joining two or more parts where at least one is made of plastic.

• Pulse heated, hot bar reflow soldering & bonding fundamentals
• Reflow soldering process overview
• Part design guidelines for reflow soldering flex to PCBs
• Heatstaking process overview
• Conductive adhesive bonding overview