Hot Bar Soldering & Bonding Heads
Hot Bar Bonding Head Modules for Integration
For heat staking and reflow soldering
The designs are modular, compact, rigid, and adjustable for maximum productivity and process control. These robust bonding heads offer superior connection accuracy for fine-pitch applications and long thermode lengths at the highest bonding
The bonding heads are available in both pneumatic and motorized models and offer a force range from 8 to 2500N.
Hot Bar Reflow Technical Datasheets
Hot Bar Reflow Soldering Resources