Hot Bar Soldering & Bonding Heads
Benchtop Bonding Heads
Manual and pneumatic bonding heads for hot bar reflow soldering, resistance soldering, bonding,and heat staking applications
Bonding Heads for Integration
Motorized and pneumatic bonding head modules for hot bar reflow soldering, bonding,resistance soldering, and heat staking applications
Typical hot bar reflow soldering applications include flex circuits, ribbon cables, wires, flex to PCB, flex to LCD, and thermocompression bonding of gold ribbon as found in the telecommunications, computer, automotive, display industries and more.
Hot bar reflow soldering is achieved when two pre-fluxed, solder or adhesive coated parts are heated, causing the solder to melt, flow, and then solidify, forming a permanent electro-mechanical bond. The bonding heads utilized in these applications may be manual/pneumatic for single-operator, benchtop manufacturing, or motorized for integration into semi- or fully-automated lines. Amada Miyachi America offers a selection of both with features like adjustable force firing and planarity adjustment to assure quality results.